Lifecycle Status  

ACTIVE (Last Updated: 6 days ago)

Factory Lead Time  

12 Weeks

Contact Plating  

Copper, Silver, Tin

Mount  

Surface Mount

Package / Case  

515-VFBGA, FCBGA

Number of Pins  

515

Memory Types  

L2 Cache, ROM, SRAM

Number of I/Os  

188

Usage Level  

Industrial grade

Operating Temperature  

-40°C~105°C TJ

Packaging  

Tray

Series  

OMAP-35xx

JESD-609 Code  

e1

Pbfree Code  

yes

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

515

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Terminal Pitch  

0.4mm

Frequency  

600MHz

Base Part Number  

OMAP3530

Pin Count  

515

Operating Supply Voltage  

1.8V

Voltage  

1.35V

Interface  

I2C, SPI, UART, USB

Max Supply Voltage  

1.89V

Min Supply Voltage  

1.71V

Memory Size  

112kB

RAM Size  

64kB

uPs/uCs/Peripheral ICs Type  

MICROPROCESSOR, RISC

Core Processor  

ARM® Cortex®-A8

Data Bus Width  

32b

Core Architecture  

ARM

Voltage - I/O  

1.8V 3.0V

Number of UART Channels  

3

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

Yes

RAM Controllers  

LPDDR

USB  

USB 1.x (3), USB 2.0 (1)

Additional Interfaces  

HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Co-Processors/DSP  

Signal Processing; C64x+, Multimedia; NEON™ SIMD

Number of Cores  

1

Display & Interface Controllers  

LCD

Height  

900μm

Length  

12mm

Width  

12mm

Thickness  

610μm

REACH SVHC  

No SVHC

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free